Cooling of Microelectronic and Nanoelectronic Equipment Advances and Emerging Research WSPC Series in Advanced Integration and Packaging Series, Vol. 3

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

A Review of Cooling Road Maps for 3D Chip Packages

Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks

Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Energy Reduction and Performance Maximization Through Improved Cooling

Optimal Choice of Heat Sinks from an Industrial Point of View

Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems

Recent Advance in Thermoelectric Devices for Electronics Cooling

Energy Efficient Solid-State Cooling for Hot Spot Removal

An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges

Estimation of Cooling Performance of Phase Change Material (PCM) Module

Optimization Under Uncertainty for Electronics Cooling Design

Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling

A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes

Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management

Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics

Towards Embedded Cooling — Gen 3 Thermal Packaging Technology